Please use this identifier to cite or link to this item:
https://thuvienso.bvu.edu.vn/handle/TVDHBRVT/16822| Title: | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect |
| Other Titles: | Springer Theses |
| Authors: | Jie Cheng |
| Keywords: | Engineerring |
| Issue Date: | 2018 |
| Publisher: | Springer |
| URI: | http://thuvienso.bvu.edu.vn/handle/TVDHBRVT/16822 |
| Other Identifiers: | 10.1007/978-981-10-6165-3 |
| Appears in Collections: | Engineering |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 978-981-10-6165-3.pdf | 6,64 MB | Adobe PDF |  Sign in to read |
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