Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Please use this identifier to cite or link to this item: http://thuvienso.bvu.edu.vn/handle/TVDHBRVT/16822

Full metadata record

DC Field	Value	Language
dc.contributor.author	Jie Cheng
dc.date.accessioned	2018-01-18T09:26:43Z	-
dc.date.available	2018-01-18T09:26:43Z	-
dc.date.issued	2018
dc.identifier	10.1007/978-981-10-6165-3
dc.identifier.uri	http://thuvienso.bvu.edu.vn/handle/TVDHBRVT/16822	-
dc.language.iso	en
dc.publisher	Springer
dc.subject	Engineerring
dc.title	Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
dc.title.alternative	Springer Theses
dc.type	ebook
Appears in Collections:	Engineering

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